Case Study: Copper Heat Dissipation Device

Process: Metal Injection Molding (MIM)

Material: Oxygen-free copper (T2)

Density: > 8.5 g/cm3

Thermal Conductivity: > 350 W/(m K)

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End Use and Function

The device is used in high-power optical modules, providing directional heat dissipation, thermal-flow management, and structural support within optical communication transceivers.

Fabrication

The integrated air-duct geometry requires an extended slide stroke and careful mold design because oxygen-free copper has challenging molding characteristics. There are 10 air ducts, each 66 mm long. Localized CNC machining is used only where needed, and the finished component is plated to enhance appearance and reduce oxidation.

Results

The MIM design replaces a complex sheet-material process that requires extensive CNC machining and wire cutting. It resolves surface-finish issues at the air-duct openings, eliminates wire cutting, supports efficient thermal management, and has enabled stable mass production of related designs.